Integrated Circuits and Systems Thermal and Power Management of Integrated Circuits, (Hardcover)

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<p>In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.</p> <p>This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.</p>

  • Integrated Circuits and Systems Thermal and Power Management of Integrated Circuits, (Hardcover)
  • Author: Springer
  • ISBN: 9780387257624
  • Format: Hardcover
  • Publication Date: 2006-01-04
  • Page Count: 182
Book format Hardcover
Fiction/nonfiction Non-Fiction
Genre Computing & Internet
Publication date January, 2006
Pages 182
Subgenre Electronics
Series title Integrated Circuits and Systems
Number in series 0
Edition 2006 Edition
Publisher Springer Us
Original languages English
Language English
Is collectible N
Binding type Case Binding
Recording time 0 min
Retail packaging Single Piece
Assembled product dimensions (l x w x h) 6.32 x 0.62 x 9.58 in
Assembled product weight 0.97 lb
Bisac subject heading Technology & Engineering

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